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As shown in our previous studies, geometrical field grading techniques such as stacked and protruding substrate designs cannot well mitigate high electric stress issue within power electronics modules. However, it was shown that a combination of protruding substrate design and applying a nonlinear field-dependent conductivity layer could address the issue. Electric filed (E) simulations were carried out according to IEC 61287-1 for the partial discharge test measurement step, where a 50/60 Hz AC voltage was applied. However, dielectrics, including ceramic substrate and silicone gel, in power devices undergo high temperatures up to a few hundred degrees and frequencies up to 1 MHz. Thus, E values obtained with electrical parameters of the mentioned dielectrics for room temperature and under 50/60 Hz may not be valid for high temperatures and frequencies mentioned above. In this paper, we address this technical gap through developing a finite element method (FEM) E calculation model developed in COMSOL Multiphysics where E calculations are carried out for different temperatures up to 250°C and frequencies up to 1 MHz. Using the model, the influence of temperature and frequency on our proposed electric field mitigation technique mentioned above is evaluated. 

Our previous studies showed that geometrical techniques including (1) metal layer offset, (2) stacked substrate design and (3) protruding substrate, either individually or combined, cannot solve high electric field issues in high voltage high-density wide bandgap (WBG) power modules. Then, for the first time, we showed that a combination of the aforementioned geometrical methods and the application of a nonlinear field-dependent conductivity (FDC) layer could address the issue. Simulations were done under a 50 Hz sinusoidal AC voltage per IEC 61287-1. However, in practice, the insulation materials of the envisaged WBG power modules will be under square wave voltage pulses with a frequency of up to a few tens of kHz and temperatures up to a few hundred degrees. The relative permittivity and electrical conductivity of aluminum nitride (AlN) ceramic, silicone gel, and nonlinear FDC materials that were assumed to be constant in our previous studies, may be frequency- and temperature-dependent, and their dependency should be considered in the model. This is the case for other papers dealing with electric field calculation within power electronics modules, where the permittivity and AC electrical conductivity of the encapsulant and ceramic substrate materials are assumed at room temperature and for a 50 or 60 Hz AC sinusoidal voltage. Thus, the big question that remains unanswered is whether or not electric field simulations are valid for high temperature and high-frequency conditions. In this paper, this technical gap is addressed where a frequency- and temperature-dependent finite element method (FEM) model of the insulation system envisaged for a 6.5 kV high-density WBG power module will be developed in COMSOL Multiphysics, where a protruding substrate combined with the application of a nonlinear FDC layer is considered to address the high field issue. By using this model, the influence of frequency and temperature on the effectiveness of the proposed electric field reduction method is studied. 

In this study, we fabricated a highly flexible fiber-based capacitive humidity sensor using a scalable convergence fiber drawing approach. The sensor’s sensing layer is made of porous polyetherimide (PEI) with its porosity produced in situ during fiber drawing, whereas its electrodes are made of copper wires. The porosity induces capillary condensation starting at a low relative humidity (RH) level (here, 70%), resulting in a significant increase in the response of the sensor at RH levels ranging from 70% to 80%. The proposed humidity sensor shows a good sensitivity of 0.39 pF/% RH in the range of 70%–80% RH, a maximum hysteresis of 9.08% RH at 70% RH, a small temperature dependence, and a good stability over a 48 h period. This work demonstrates the first fiber-based humidity sensor fabricated using convergence fiber drawing. 

Abstract With the recent development of wearable electronics and smart textiles, flexible sensor technology is gaining increasing attention. Compared to flexible film‐based sensors, multimaterial fiber‐based technology offers unique advantages due to the breathability, durability, wear resistance, and stretchability in fabric structures. Despite the significant progress made in the fabrication and application of fiber‐based sensors, none of the existing fiber technologies allow for fully distributed pressure or temperature sensing. Herein, the design and fabrication of thermally drawn multi‐material fibers that offer distributed temperature and pressure measurement capability is reported. Thermoplastic materials, thermoplastic elastomers, and metal electrodes are successfully co‐drawn in one fiber. The embedded electrodes inside the fibers form a parallel wire transmission line, and the local characteristic impedance is designed to change with the temperature or pressure. The electrical frequency domain reflectometry is used to interrogate the impedance change along the fiber and provides information with high spatial resolution. The two types of fibers reported in this manuscript have a pressure sensitivity of 4 kPa and a temperature sensitivity of 2 °C, respectively. This work can pave the road for development of functional fibers and textiles for pressure and temperature mapping.